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CONN IC DIP SOCKET ZIF 44POS GLD
| Part | Housing Material | Current Rating (Amps) | Material Flammability Rating | Termination | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Material - Post | Contact Finish - Post | Number of Positions or Pins (Grid) | Termination Post Length | Termination Post Length | Type | Type | Type | Pitch - Mating | Pitch - Mating | Features | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | UL94 V-0 | Solder | Through Hole | 10 çin | 0.25 çm | Gold | Beryllium Copper | Gold | 44 Positions or Pins | 0.11 in | 2.78 mm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | Beryllium Copper | 10 çin | 0.25 çm |
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | UL94 V-0 | Solder | Through Hole | 50 µin | 1.27 µm | Nickel Boron | Beryllium Nickel | Nickel Boron | 44 Positions or Pins | 0.11 in | 2.78 mm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | Beryllium Nickel | 50 µin | 1.27 µm |
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | UL94 V-0 | Solder | Through Hole | 200 µin | 5.08 µm | Beryllium Copper | Tin | 44 Positions or Pins | 0.11 in | 2.78 mm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | Beryllium Copper | 200 µin | 5.08 µm |