40-1518 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Current Rating	Termination Post Length	Material Flammability Rating	Contact Finish - Post	Contact Finish Thickness - Mating	Housing Material	Row Spacing	Type	Contact Material - Mating	Pitch - Post	Termination	Contact Finish - Mating	Features	Contact Material - Post	Contact Finish Thickness - Post	Mounting Type	Pitch - Mating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows
Aries Electronics 40-1518-11	3 A	0.125 in	UL94 V-0	Gold	10 µin	Glass Filled Nylon 4/6 PA46 Polyamide	0.2 in	0.2" (5.08mm) Row Spacing DIP	Beryllium Copper	0.1 in	Solder	Gold	Open Frame	Brass	10 µin	Through Hole	0.1 in	20	40	2
Aries Electronics 40-1518-11H	3 A	0.125 in	UL94 V-0	Gold	10 µin	Glass Filled Nylon 4/6 PA46 Polyamide	0.2 in	0.2" (5.08mm) Row Spacing DIP	Beryllium Copper	0.1 in	Solder	Gold	Open Frame	Brass	10 µin	Through Hole	0.1 in	20	40	2