IPBT-111 Series

Catalog

CONN HEADER R/A 22POS 4.20MM

Part	Row Spacing - Mating	Row Spacing - Mating	Style	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish - Post	Contact Type	Number of Positions	Contact Length - Post	Contact Length - Post	Insulation Color	Connector Type	Termination	Number of Positions Loaded	Contact Length - Mating [custom]	Contact Length - Mating [custom]	Pitch - Mating	Pitch - Mating	Insulation Material	Contact Shape	Material Flammability Rating	Number of Rows	Voltage Rating	Contact Material	Shrouding	Insulation Height [z]	Insulation Height [z]	Fastening Type	Mounting Type	Insulation Height	Insulation Height	Features
Samtec Inc. IPBT-111-H1-T-D-RA-K	4.2 mm	0.165 in	Board to Board Cable	105 ░C	-55 °C	Tin	Male Pin	22 positions	3.73 mm	0.147 in	Black	Header	Solder	All	6.6 mm	0.26 in	4.2 mm	0.165 in	Liquid Crystal Polymer (LCP)	Square	UL94 V-0	2	400 VAC 565 VDC	Copper Alloy	Shrouded - 4 Wall	10.77 mm	0.424 in	Locking Ramp	Through Hole Right Angle
Samtec Inc. IPBT-111-H1-T-D-K	4.2 mm	0.165 in	Board to Board Cable	105 ░C	-55 °C	Tin	Male Pin	22 positions	3.3 mm	0.13 in	Black	Header	Solder	All	6.6 mm	0.26 in	4.2 mm	0.165 in	Liquid Crystal Polymer (LCP)	Square	UL94 V-0	2	400 VAC 565 VDC	Copper Alloy	Shrouded - 4 Wall			Locking Ramp	Through Hole	0.38 in	9.65 mm
Samtec Inc. IPBT-111-H1-T-D-GP	4.2 mm	0.165 in	Board to Board Cable	105 ░C	-55 °C	Tin	Male Pin	22 positions	3.3 mm	0.13 in	Black	Header	Solder	All	6.6 mm	0.26 in	4.2 mm	0.165 in	Liquid Crystal Polymer (LCP)	Square	UL94 V-0	2	400 VAC 565 VDC	Copper Alloy	Shrouded - 4 Wall			Locking Ramp	Through Hole	0.38 in	9.65 mm	Mating Flange
Samtec Inc. IPBT-111-H2-T-D-K	4.2 mm	0.165 in	Board to Board Cable	105 ░C	-55 °C	Tin	Male Pin	22 positions			Black	Header	Solder	All	6.6 mm	0.26 in	4.2 mm	0.165 in	Liquid Crystal Polymer (LCP)	Square	UL94 V-0	2	400 VAC 565 VDC	Copper Alloy	Shrouded - 4 Wall			Locking Ramp	Surface Mount	0.38 in	9.65 mm