20-3508 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Termination	Current Rating (Amps)	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Contact Material - Mating	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 20-3508-31	UL94 V-0	0.1 in	2.54 mm	Through Hole	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Gold	Wire Wrap	3 A	Open Frame	10 çin	0.25 çm	-55 °C	125 °C	0.3 "	7.62 mm	DIP	Beryllium Copper	20	0.5 in	12.7 mm	2.54 mm	0.1 in	Brass
Aries Electronics 20-3508-202	UL94 V-0	0.1 in	2.54 mm	Through Hole	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Tin	Wire Wrap	3 A	Open Frame	200 µin	5.08 µm	-55 °C	105 ░C	0.3 "	7.62 mm	DIP	Beryllium Copper	20			2.54 mm	0.1 in	Brass	0.36 in	9.14 mm
Aries Electronics 20-3508-311	UL94 V-0	0.1 in	2.54 mm	Through Hole	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Gold	Wire Wrap	3 A	Open Frame	10 çin	0.25 çm	-55 °C	125 °C	0.3 "	7.62 mm	DIP	Beryllium Copper	20	0.5 in	12.7 mm	2.54 mm	0.1 in	Brass
Aries Electronics 20-3508-302	UL94 V-0	0.1 in	2.54 mm	Through Hole	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Tin	Wire Wrap	3 A	Open Frame	200 µin	5.08 µm	-55 °C	105 ░C	0.3 "	7.62 mm	DIP	Beryllium Copper	20			2.54 mm	0.1 in	Brass	0.36 in	9.14 mm
Aries Electronics 20-3508-20	UL94 V-0	0.1 in	2.54 mm	Through Hole	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Tin	Wire Wrap	3 A	Open Frame	200 µin	5.08 µm	-55 °C	105 ░C	0.3 "	7.62 mm	DIP	Beryllium Copper	20			2.54 mm	0.1 in	Brass	0.36 in	9.14 mm