20-3508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 20POS GOLD
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Contact Finish Thickness - Post | Pitch - Post | Mounting Type | Contact Finish - Post | Housing Material | Contact Finish Thickness - Mating | Pitch - Mating | Contact Material - Mating | Row Spacing | Type | Features | Contact Finish - Mating | Contact Material - Post | Termination | Grid Rows | Grid Columns | Number of Positions or Pins (Grid) | Operating Temperature (Max) | Operating Temperature (Min) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | 10 µin | 0.1 in | Through Hole | Gold | Glass Filled Nylon 4/6 PA46 Polyamide | 30 µin | 0.1 in | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Open Frame | Gold | Brass | Wire Wrap | 2 | 10 | 20 | 125 °C | -55 °C |
Aries Electronics | 3 A | UL94 V-0 | 0.36 in | 200 µin | 0.1 in | Through Hole | Tin | Glass Filled Nylon 4/6 PA46 Polyamide | 30 µin | 0.1 in | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Open Frame | Gold | Brass | Wire Wrap | 2 | 10 | 20 | 105 °C | -55 °C |
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | 10 µin | 0.1 in | Through Hole | Gold | Glass Filled Nylon 4/6 PA46 Polyamide | 30 µin | 0.1 in | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Open Frame | Gold | Brass | Wire Wrap | 2 | 10 | 20 | 125 °C | -55 °C |
Aries Electronics | 3 A | UL94 V-0 | 0.5 in | 10 µin | 0.1 in | Through Hole | Gold | Glass Filled Nylon 4/6 PA46 Polyamide | 30 µin | 0.1 in | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Open Frame | Gold | Brass | Wire Wrap | 2 | 10 | 20 | 125 °C | -55 °C |
Aries Electronics | 3 A | UL94 V-0 | 0.36 in | 200 µin | 0.1 in | Through Hole | Tin | Glass Filled Nylon 4/6 PA46 Polyamide | 30 µin | 0.1 in | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Open Frame | Gold | Brass | Wire Wrap | 2 | 10 | 20 | 105 °C | -55 °C |
Aries Electronics | 3 A | UL94 V-0 | 0.36 in | 200 µin | 0.1 in | Through Hole | Tin | Glass Filled Nylon 4/6 PA46 Polyamide | 30 µin | 0.1 in | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Open Frame | Gold | Brass | Wire Wrap | 2 | 10 | 20 | 105 °C | -55 °C |