HPF-11 Series
Manufacturer: Samtec Inc.
.200 HI POWER SOCKET ASSEMBLY
| Part | Termination | Insulation Material | Contact Finish - Mating | Insulation Color | Contact Finish - Post | Contact Shape | Number of Positions Loaded | Number of Rows | Features | Connector Type | Contact Type | Fastening Type | Mounting Type | Pitch - Mating | Style | Number of Positions | Contact Material | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | Liquid Crystal Polymer (LCP) | Tin | Black | Tin | Square | All | 1 | Board Lock | Receptacle | Female Socket | Push-Pull | Surface Mount | 0.2 in | Board | 11 | Beryllium Copper | 0.351 in |