18-8700 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 18POS GOLD
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Grid Columns | Grid Rows | Number of Positions or Pins (Grid) | Contact Finish - Post | Pitch - Mating | Contact Material - Post | Contact Material - Mating | Features | Mounting Type | Pitch - Post | Contact Finish - Mating | Operating Temperature (Min) | Operating Temperature (Max) | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Housing Material | Row Spacing | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | UL94 V-0 | 0.14 in | 9 | 2 | 18 | Gold | 0.1 in | Brass | Beryllium Copper | Closed Frame Elevated | Through Hole | 0.1 in | Gold | -55 °C | 105 °C | Solder | 10 µin | 30 µin | Glass Filled Nylon 4/6 PA46 Polyamide | 0.6 in | 0.6" (15.24mm) Row Spacing DIP |