AT97SC3204 Series
Manufacturer: Microchip Technology
TPM TWI INDL 40-MLF UNSIGNED EK 40 VQFN 6X6X1MM T/R ROHS COMPLIANT: YES
| Part | Package / Case | Interface | Voltage - Supply | Core Processor | Applications | Package Width | Package Name | Package Length | Program Memory Type | Mounting Type | Operating Temperature (Min) | Operating Temperature (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 40-VFQFN Exposed Pad | I2C | 3.3 V | AVR | Trusted Platform Module (TPM) | 6 mm | 40-VQFN | 6 mm | EEPROM | Surface Mount | -40 °C | 85 °C |
Microchip Technology | LPC | 3.3 V | AVR | Trusted Platform Module (TPM) | 4.4 mm | 28-TSSOP | 0.173 in | EEPROM | Surface Mount | -40 °C | 85 °C | |
Microchip Technology | LPC | 3.3 V | AVR | Trusted Platform Module (TPM) | 4.4 mm | 28-TSSOP | 0.173 in | EEPROM | Surface Mount | -40 °C | 85 °C | |
Microchip Technology | 40-VFQFN Exposed Pad | LPC | 3.3 V | AVR | Trusted Platform Module (TPM) | 6 mm | 40-VQFN | 6 mm | EEPROM | Surface Mount | 0 °C | 70 °C |
Microchip Technology | LPC | 3.3 V | AVR | Trusted Platform Module (TPM) | 6.1 mm | 28-TSSOP | 0.24 in | EEPROM | Surface Mount | -40 °C | 85 °C | |
Microchip Technology | LPC | 3.3 V | AVR | Trusted Platform Module (TPM) | 4.4 mm | 28-TSSOP | 0.173 in | EEPROM | Surface Mount | -40 °C | 85 °C | |
Microchip Technology | 40-VFQFN Exposed Pad | LPC | 3.3 V | AVR | Trusted Platform Module (TPM) | 6 mm | 40-VQFN | 6 mm | EEPROM | Surface Mount | 0 °C | 70 °C |
Microchip Technology | I2C | 3.3 V | AVR | Trusted Platform Module (TPM) | 4.4 mm | 28-TSSOP | 0.173 in | EEPROM | Surface Mount | -40 °C | 85 °C | |
Microchip Technology | 40-VFQFN Exposed Pad | LPC | 3.3 V | AVR | Trusted Platform Module (TPM) | 6 mm | 40-VQFN | 6 mm | EEPROM | Surface Mount | -40 °C | 85 °C |
Microchip Technology | 40-VFQFN Exposed Pad | I2C | 3.3 V | AVR | Trusted Platform Module (TPM) | 6 mm | 40-VQFN | 6 mm | EEPROM | Surface Mount | 0 °C | 70 °C |