ESQT-104 Series
Manufacturer: Samtec Inc.
Beta
⌘K
CONN SOCKET 8POS 0.079 GOLD PCB
| Part | Mounting Type | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Mating | Contact Length - Post | Pitch - Mating | Row Spacing - Mating | Termination | Style | Number of Positions | Number of Positions Loaded | Contact Finish - Post | Current Rating (Per Contact) | Fastening Type | Contact Finish Thickness - Mating | Connector Type | Contact Type | Number of Rows | Insulation Color | Material Flammability Rating | Insulation Height | Insulation Material | Contact Shape | Contact Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.495 in | 0.079 in | 0.079 in | Solder | Board Board or Cable | 8 | All | Tin | 4.5 A | Push-Pull | 3 µin | Elevated Socket | Forked | 2 | Black | UL94 V-0 | 0.355 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.42 in | 0.079 in | Solder | Board Board or Cable | 4 | All | Gold | 4.5 A | Push-Pull | 20 Ąin | Elevated Socket | Forked | 1 | Black | UL94 V-0 | 0.43 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin | |
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.073 in | 0.079 in | 0.079 in | Solder | Board Board or Cable | 8 | All | Gold | 4.5 A | Push-Pull | 20 Ąin | Elevated Socket | Forked | 2 | Black | UL94 V-0 | 0.385 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin |
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.093 in | 0.079 in | Solder | Board Board or Cable | 4 | All | Tin | 4.5 A | Push-Pull | 3 µin | Elevated Socket | Forked | 1 | Black | UL94 V-0 | 0.365 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | ||
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.44 in | 0.079 in | 0.079 in | Solder | Board Board or Cable | 8 | All | Tin | 4.5 A | Push-Pull | 3 µin | Elevated Socket | Forked | 2 | Black | UL94 V-0 | 0.41 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.24 in | 0.079 in | Solder | Board Board or Cable | 4 | All | Tin | 4.5 A | Push-Pull | 10 µin | Elevated Socket | Forked | 1 | Black | UL94 V-0 | 0.61 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | ||
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.083 in | 0.079 in | 0.079 in | Solder | Board Board or Cable | 12 | All | Gold | 4.5 A | Push-Pull | 30 µin | Elevated Socket | Forked | 3 | Black | UL94 V-0 | 0.375 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin |
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.42 in | 0.079 in | Solder | Board Board or Cable | 4 | All | Gold | 4.5 A | Push-Pull | 20 Ąin | Elevated Socket | Forked | 1 | Black | UL94 V-0 | 0.43 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin | |
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.161 in | 0.079 in | Solder | Board Board or Cable | 4 | All | Tin | 4.5 A | Push-Pull | 30 µin | Elevated Socket | Forked | 1 | Black | UL94 V-0 | 0.689 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | ||
Samtec Inc. | Through Hole | 125 °C | -55 °C | Gold | 0.11 in | 0.079 in | 0.079 in | Solder | Board Board or Cable | 8 | All | Tin | 4.5 A | Push-Pull | 3 µin | Elevated Socket | Forked | 2 | Black | UL94 V-0 | 0.74 in | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze |