SOLDER WIRE 63/37 TIN/LEAD NO-CL
| Part | Flux Type | Process | Diameter [diameter] | Diameter [diameter] | Form | Form | Form | Melting Point [custom] | Melting Point [custom] | Wire Gauge | Type | Composition [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. SMDSW.015 100G | No-Clean, Water Soluble | Leaded | 0.015 in | 0.38 mm | 100 g | Spool | 3.53 oz | 361 °F | 183 °C | 27 AWG, 28 SWG | Wire Solder | |
Chip Quik Inc. SMDSWLT.047 8OZ | 0.047 in | 1.19 mm | 227 g | Spool | 0.5 lb, 8 oz | 280 °F | 138 °C | Wire Solder | Bi57Sn42Ag1 (57/42/1) | |||
Chip Quik Inc. SMDSW.020 8OZ | No-Clean, Water Soluble | Leaded | 0.02 in | 0.51 mm | 227 g | Spool | 0.5 lb, 8 oz | 361 °F | 183 °C | 24 AWG, 25 mmý | Wire Solder | |
Chip Quik Inc. SMDSWLT.047 2OZ | 0.047 in | 1.19 mm | 56.7 g | Spool | 2 oz | 280 °F | 138 °C | Wire Solder | Bi57Sn42Ag1 (57/42/1) | |||
Chip Quik Inc. SMDSWLT.047 1OZ | 0.047 in | 1.19 mm | 28.35 g | Spool | 1 oz | 280 °F | 138 °C | Wire Solder | Bi57Sn42Ag1 (57/42/1) | |||
Chip Quik Inc. SMDSWLT.047 4OZ | 0.047 in | 1.19 mm | 113.4 g | Spool | 4 oz | 280 °F | 138 °C | Wire Solder | Bi57Sn42Ag1 (57/42/1) |