HPF-18 Series
Manufacturer: Samtec Inc.
Beta
⌘K
.200 HI POWER SOCKET ASSEMBLY
| Part | Contact Shape | Insulation Material | Contact Material | Number of Positions Loaded | Features | Insulation Color | Contact Type | Contact Finish - Mating | Mounting Type | Termination | Pitch - Mating | Fastening Type | Style | Connector Type | Insulation Height | Contact Finish - Post | Number of Rows | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Square | Liquid Crystal Polymer (LCP) | Beryllium Copper | All | Board Lock | Black | Female Socket | Tin | Surface Mount | Solder | 0.2 in | Push-Pull | Board | Receptacle | 0.351 in | Tin | 1 | 18 |