TMM-101 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 1POS
| Part | Number of Positions Loaded | Contact Material | Contact Finish - Mating | Contact Finish - Post | Number of Positions | Contact Shape | Insulation Material | Connector Type | Termination | Mounting Type | Shrouding | Contact Finish Thickness - Mating | Style | Number of Rows | Contact Type | Operating Temperature (Max) | Operating Temperature (Min) | Fastening Type | Insulation Height | Material Flammability Rating | Contact Length - Mating | Insulation Color | Current Rating (Per Contact) | Contact Finish Thickness - Post | Contact Length - Post | Overall Contact Length | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | All | Phosphor Bronze | Gold | Gold | 1 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Surface Mount | Unshrouded | 20 Ąin | Board Board or Cable | 1 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.059 in | UL94 V-0 | 0.126 in | Black | 3.2 A | 3 µin | |||
Samtec Inc. | All | Phosphor Bronze | Gold | Gold | 1 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Through Hole | Unshrouded | 20 Ąin | Board Board or Cable | 1 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.059 in | 0.126 in | Black | 3.2 A | 3 µin | 0.138 in | 0.323 in | ||
Samtec Inc. | All | Phosphor Bronze | Gold | Gold | 1 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Through Hole | Unshrouded | 20 Ąin | Board Board or Cable | 1 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.059 in | 0.065 in | Black | 3.2 A | 3 µin | 0.09 in | 0.214 in | ||
Samtec Inc. | All | Phosphor Bronze | Gold | Gold | 2 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Right Angle Through Hole | Unshrouded | 20 Ąin | Board Board or Cable | 2 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.155 in | 0.126 in | Black | 3.2 A | 3 µin | 0.12 in | 0.079 in | ||
Samtec Inc. | All | Phosphor Bronze | Gold | Tin | 2 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Through Hole | Unshrouded | 10 µin | Board Board or Cable | 2 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.059 in | 0.075 in | Black | 3.2 A | 0.09 in | 0.224 in | 0.079 in | ||
Samtec Inc. | All | Phosphor Bronze | Gold | Tin | 1 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Through Hole | Unshrouded | 30 µin | Board Board or Cable | 1 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.059 in | 0.146 in | Black | 3.2 A | 0.118 in | 0.323 in | |||
Samtec Inc. | All | Phosphor Bronze | Gold | Tin | 1 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Through Hole | Unshrouded | 10 µin | Board Board or Cable | 1 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.059 in | 0.126 in | Black | 3.2 A | 0.192 in | 0.377 in | |||
Samtec Inc. | All | Phosphor Bronze | Gold | Tin | 2 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Right Angle Through Hole | Unshrouded | 30 µin | Board Board or Cable | 2 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.155 in | 0.126 in | Black | 3.2 A | 0.12 in | 0.079 in | |||
Samtec Inc. | All | Phosphor Bronze | Gold | Tin | 1 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Right Angle Through Hole | Unshrouded | 10 µin | Board Board or Cable | 1 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.079 in | 0.126 in | Black | 3.2 A | 0.12 in | ||||
Samtec Inc. | All | Phosphor Bronze | Gold | Gold | 2 | Square | Liquid Crystal Polymer (LCP) | Header | Solder | Right Angle Through Hole | Unshrouded | 20 Ąin | Board Board or Cable | 2 | Male Pin | 125 °C | -55 °C | Push-Pull | 0.155 in | 0.126 in | Black | 3.2 A | 3 µin | 0.12 in | 0.079 in |