28-C182 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Contact Finish - Post	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Finish - Mating	Material Flammability Rating	Pitch - Post	Pitch - Post	Termination	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Contact Material - Mating	Current Rating (Amps)	Contact Material - Post [custom]	Type	Type	Type	Features
Aries Electronics 28-C182-30	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Through Hole	Gold	UL94 V-0	2.54 mm	0.1 in	Wire Wrap	105 ░C	-55 °C	28	200 µin	5.08 µm	0.1 in	2.54 mm	0.04 in	1.02 mm	Beryllium Copper	3 A	Brass	DIP	0.6 in	15.24 mm	Closed Frame
Aries Electronics 28-C182-20	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Through Hole	Gold	UL94 V-0	2.54 mm	0.1 in	Wire Wrap	105 ░C	-55 °C	28	200 µin	5.08 µm	0.1 in	2.54 mm	0.04 in	1.02 mm	Beryllium Copper	3 A	Brass	DIP	0.6 in	15.24 mm	Closed Frame
Aries Electronics 28-C182-31	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Through Hole	Gold	UL94 V-0	2.54 mm	0.1 in	Wire Wrap	125 °C	-55 °C	28	10 çin	0.25 çm	0.1 in	2.54 mm	0.04 in	1.02 mm	Beryllium Copper	3 A	Brass	DIP	0.6 in	15.24 mm	Closed Frame
Aries Electronics 28-C182-11H	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Through Hole	Gold	UL94 V-0	2.54 mm	0.1 in	Solder	125 °C	-55 °C	28	10 çin	0.25 çm	0.1 in	2.54 mm	0.125 in	3.18 mm	Beryllium Copper	3 A	Brass	DIP	0.6 in	15.24 mm	Closed Frame
Aries Electronics 28-C182-10	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Through Hole	Gold	UL94 V-0	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	28	200 µin	5.08 µm	0.1 in	2.54 mm	0.125 in	3.18 mm	Beryllium Copper	3 A	Brass	DIP	0.6 in	15.24 mm	Closed Frame
Aries Electronics 28-C182-00	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Surface Mount	Gold	UL94 V-0	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	28	200 µin	5.08 µm	0.1 in	2.54 mm	0.04 in	1.02 mm	Beryllium Copper	3 A	Brass	DIP	0.6 in	15.24 mm	Closed Frame
Aries Electronics 28-C182-11	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Through Hole	Gold	UL94 V-0	2.54 mm	0.1 in	Solder	125 °C	-55 °C	28	10 çin	0.25 çm	0.1 in	2.54 mm	0.125 in	3.18 mm	Beryllium Copper	3 A	Brass	DIP	0.6 in	15.24 mm	Closed Frame