TEM-145 Series

Catalog

.8MM TIGER EYE MICRO TERMINAL

Part	Operating Temperature [Min]	Operating Temperature [Max]	Features	Pitch - Mating	Pitch - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Connector Type	Current Rating (Amps)	Termination	Shrouding	Contact Shape	Contact Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Rows	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions	Insulation Height	Insulation Height	Insulation Material	Number of Positions Loaded	Contact Finish - Mating	Fastening Type	Mated Stacking Heights	Mounting Type	Insulation Color	Contact Type	Contact Finish - Post
Samtec Inc. TEM-145-02-03.0-FG-D-LC-K	-55 °C	125 °C	Board Lock Pick and Place	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	3 µin	0.076 µm	2	3 µin	0.076 µm	90	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	6 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-07.0-H-D-A-K	-55 °C	125 °C	Board Guide Pick and Place	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	30 Áin	0.76 Ám	2	3 µin	0.076 µm	90			Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	10 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-04.0-G-D-WT	-55 °C	125 °C	Solder Retention	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	10 çin	0.25 çm	2	3 µin	0.076 µm	90	6.6 mm	0.26 in	Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	7 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-03.0-G-D-LC	-55 °C	125 °C		0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	10 çin	0.25 çm	2	3 µin	0.076 µm	90	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	6 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-07.0-G-D-A-K-TR	-55 °C	125 °C	Board Guide Pick and Place	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	10 çin	0.25 çm	2	3 µin	0.076 µm	90			Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	10 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-03.0-H-D	-55 °C	125 °C		0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	30 Áin	0.76 Ám	2	3 µin	0.076 µm	90	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	6 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-04.0-G-D-WT-K	-55 °C	125 °C	Pick and Place Solder Retention	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	10 çin	0.25 çm	2	3 µin	0.076 µm	90	6.6 mm	0.26 in	Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	7 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-03.0-H-D-WT	-55 °C	125 °C	Solder Retention	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	30 Áin	0.76 Ám	2	3 µin	0.076 µm	90	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	6 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-07.0-H-D-WT	-55 °C	125 °C	Solder Retention	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	30 Áin	0.76 Ám	2	3 µin	0.076 µm	90			Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	10 mm	Surface Mount	Black	Male Pin	Gold
Samtec Inc. TEM-145-02-07.0-FG-D-A	-55 °C	125 °C	Board Guide	0.031 in	0.8 mm	1.6 mm	0.063 in	Header	2.9 A	Solder	Shrouded - 4 Wall	Square	Phosphor Bronze	3 µin	0.076 µm	2	3 µin	0.076 µm	90			Liquid Crystal Polymer (LCP)	All	Gold	Push-Pull	10 mm	Surface Mount	Black	Male Pin	Gold