TEM-145 Series

Catalog

.8MM TIGER EYE MICRO TERMINAL

Part	Current Rating (Per Contact)	Contact Finish - Mating	Features	Row Spacing - Mating	Style	Insulation Height	Insulation Color	Contact Finish Thickness - Mating	Pitch - Mating	Number of Rows	Number of Positions	Number of Positions Loaded	Fastening Type	Contact Material	Operating Temperature (Max)	Operating Temperature (Min)	Contact Shape	Mounting Type	Termination	Insulation Material	Connector Type	Contact Finish - Post	Contact Type	Shrouding	Mated Stacking Height	Contact Finish Thickness - Post
Samtec Inc. TEM-145-02-03.0-FG-D-LC-K	2.9 A	Gold	Board Lock Pick and Place	0.063 in	Board	0.22 in	Black	3 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	6 mm	3 µin
Samtec Inc. TEM-145-02-07.0-G-D-WT-K	2.9 A	Gold	Pick and Place Solder Retention	0.063 in	Board	0.378 in	Black	10 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	10 mm	3 µin
Samtec Inc. TEM-145-02-07.0-H-D-A-K	2.9 A	Gold	Board Guide Pick and Place	0.063 in	Board	0.378 in	Black	30 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	10 mm	3 µin
Samtec Inc. TEM-145-02-03.0-G-D-LC	2.9 A	Gold	Board Lock	0.063 in	Board	0.22 in	Black	10 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	6 mm	3 µin
Samtec Inc. TEM-145-02-07.0-G-D-A-K-TR	2.9 A	Gold	Board Guide Pick and Place	0.063 in	Board	0.378 in	Black	10 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	10 mm	3 µin
Samtec Inc. TEM-145-02-03.0-H-D	2.9 A	Gold		0.063 in	Board	0.22 in	Black	30 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	6 mm	3 µin
Samtec Inc. TEM-145-02-04.0-G-D-WT-K	2.9 A	Gold	Pick and Place Solder Retention	0.063 in	Board	0.26 in	Black	10 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	7 mm	3 µin
Samtec Inc. TEM-145-02-03.0-H-D-WT	2.9 A	Gold	Solder Retention	0.063 in	Board	0.22 in	Black	30 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	6 mm	3 µin
Samtec Inc. TEM-145-02-07.0-H-D-WT	2.9 A	Gold	Solder Retention	0.063 in	Board	0.378 in	Black	30 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	10 mm	3 µin
Samtec Inc. TEM-145-02-07.0-FG-D-A	2.9 A	Gold	Board Guide	0.063 in	Board	0.378 in	Black	3 µin	0.031 in	2	90	All	Push-Pull	Phosphor Bronze	125 °C	-55 °C	Square	Surface Mount	Solder	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Shrouded - 4 Wall	10 mm	3 µin