16-3518 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Contact Material - Mating	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Finish - Post	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Features	Housing Material	Mounting Type	Number of Positions or Pins (Grid)	Termination	Contact Finish - Mating
Aries Electronics 16-3518-10M	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	200 µin	5.08 µm	10 çin	0.25 çm	3 A	Tin	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-111	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	10 çin	0.25 çm	10 çin	0.25 çm	3 A	Gold	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-10	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	200 µin	5.08 µm	10 çin	0.25 çm	3 A	Tin	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-101	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	200 µin	5.08 µm	10 çin	0.25 çm	3 A	Tin	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-11	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	10 çin	0.25 çm	10 çin	0.25 çm	3 A	Gold	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-102	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	200 µin	5.08 µm	10 çin	0.25 çm	3 A	Tin	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-10H	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	200 µin	5.08 µm	10 çin	0.25 çm	3 A	Tin	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-101H	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	200 µin	5.08 µm	10 çin	0.25 çm	3 A	Tin	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-01	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	10 çin	0.25 çm	10 çin	0.25 çm	3 A	Gold	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	16	Solder	Gold
Aries Electronics 16-3518-00	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Brass	Beryllium Copper	UL94 V-0	200 µin	5.08 µm	10 çin	0.25 çm	3 A	Tin	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Surface Mount	16	Solder	Gold