CONN EDGE DUAL FMALE 40POS 0.05
| Part | Pitch [x] | Pitch [x] | Termination | Card Type | Color | Contact Finish Thickness | Contact Finish Thickness | Read Out | Gender | Number of Rows | Number of Positions | Material - Insulation | Mounting Type | Contact Finish | Contact Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material | Card Thickness | Card Thickness | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.05 in | 1.27 mm | Solder | Non Specified - Dual Edge | Black | 10 Áin | 0.25 Ám | Dual | Female | 2 | 40 | Liquid Crystal Polymer (LCP) | Surface Mount | Gold | Cantilever | -55 °C | 125 °C | Beryllium Copper | 0.062 in | 1.57 mm | Board Guide |
Samtec Inc. | 0.05 in | 1.27 mm | Solder | Non Specified - Dual Edge | Natural | 10 Áin | 0.25 Ám | Dual | Female | 2 | 40 | Liquid Crystal Polymer (LCP) | Surface Mount | Gold | Cantilever | -55 °C | 125 °C | Beryllium Copper | 0.093 in | 2.36 mm | Board Guide |
Samtec Inc. | 0.05 in | 1.27 mm | Solder | Non Specified - Dual Edge | Black | 10 Áin | 0.25 Ám | Dual | Female | 2 | 40 | Liquid Crystal Polymer (LCP) | Surface Mount | Gold | Cantilever | -55 °C | 125 °C | Beryllium Copper | 0.062 in | 1.57 mm | Board Guide |
Samtec Inc. | 0.05 in | 1.27 mm | Solder | Non Specified - Dual Edge | Black | 10 Áin | 0.25 Ám | Dual | Female | 2 | 40 | Liquid Crystal Polymer (LCP) | Surface Mount | Gold | Cantilever | -55 °C | 125 °C | Beryllium Copper | 0.062 in | 1.57 mm | Board Guide |
Samtec Inc. | 0.05 in | 1.27 mm | Solder | Non Specified - Dual Edge | Black | 10 Áin | 0.25 Ám | Dual | Female | 2 | 40 | Liquid Crystal Polymer (LCP) | Surface Mount | Gold | Cantilever | -55 °C | 125 °C | Beryllium Copper | 0.062 in | 1.57 mm | Board Guide |