32-3572 Series

Catalog

32P DIP NICKEL BORON BERYLLIUM NICKEL 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Termination	Pitch - Post	Pitch - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Material Flammability Rating	Contact Material - Post	Mounting Type	Contact Finish - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length
Aries Electronics 32-3572-16	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Solder	2.54 mm	0.1 in	Closed Frame	1.27 µm	50 µin	Beryllium Nickel	UL94 V-0	Beryllium Nickel	Through Hole	Nickel Boron	Nickel Boron	1.27 µm	50 µin	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	0.1 in	2.54 mm	0.11 in	2.78 mm
Aries Electronics 32-3572-10	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Solder	2.54 mm	0.1 in	Closed Frame	5.08 µm	200 µin	Beryllium Copper	UL94 V-0	Beryllium Copper	Through Hole		Tin	5.08 µm	200 µin	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	0.1 in	2.54 mm	0.11 in	2.78 mm
Aries Electronics 32-3572-11	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Solder	2.54 mm	0.1 in	Closed Frame	0.25 çm	10 çin	Beryllium Copper	UL94 V-0	Beryllium Copper	Through Hole	Gold	Gold	0.25 çm	10 çin	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	0.1 in	2.54 mm	0.11 in	2.78 mm