CONN IC DIP SOCKET ZIF 48POS
| Part | Pitch - Post | Pitch - Post | Housing Material | Type | Type | Type | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Termination | Contact Material - Post | Contact Material - Mating | Material Flammability Rating | Features | Termination Post Length | Termination Post Length | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6553-16 | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS), Glass Filled | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 1 A | 0.1 in | 2.54 mm | Nickel Boron | 48 | 1.27 µm | 50 µin | Nickel Boron | 1.27 µm | 50 µin | Through Hole | Solder | Beryllium Copper | Beryllium Copper | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | ||
Aries Electronics 48-6553-11 | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS), Glass Filled | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 1 A | 0.1 in | 2.54 mm | Gold | 48 | Gold | Through Hole | Solder | Beryllium Copper | Beryllium Copper | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | ||||||
Aries Electronics 48-6553-10 | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS), Glass Filled | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 1 A | 0.1 in | 2.54 mm | Tin | 48 | 5.08 µm | 200 µin | 5.08 µm | 200 µin | Through Hole | Solder | Beryllium Copper | Beryllium Copper | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | |||
Aries Electronics 48-6553-18 | 2.54 mm | 0.1 in | Polyetheretherketone (PEEK), Glass Filled | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 1 A | 0.1 in | 2.54 mm | Nickel Boron | 48 | 1.27 µm | 50 µin | Nickel Boron | 1.27 µm | 50 µin | Through Hole | Solder | Beryllium Nickel | Beryllium Nickel | UL94 V-0 | Closed Frame | 0.11 in | 2.78 mm | -55 °C | 250 °C |