35-0518 Series

Catalog

CONN SOCKET SIP 35POS GOLD

Part	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Type	Features	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Mounting Type	Housing Material	Contact Material - Mating	Material Flammability Rating	Termination Post Length [x]	Termination Post Length [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Termination Post Length	Termination Post Length
Aries Electronics 35-0518-00	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Surface Mount	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0	0.046 in	1.17 mm	200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder
Aries Electronics 35-0518-11	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Gold	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			10 çin	0.25 çm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-10	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-10T	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-11H	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Gold	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			10 çin	0.25 çm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in
Aries Electronics 35-0518-10H	Gold	1	35	35	Brass	2.54 mm	0.1 in	SIP	Open Frame	Tin	0.1 in	2.54 mm	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	UL94 V-0			200 µin	5.08 µm	3 A	10 çin	0.25 çm	Solder	3.18 mm	0.125 in