32-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Contact Material - Post	Contact Material - Mating	Material Flammability Rating	Termination	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Post	Pitch - Post	Mounting Type	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Finish - Post	Housing Material	Features
Aries Electronics 32-6574-11	Beryllium Copper	Beryllium Copper	UL94 V-0	Solder	0.1 in	2.54 mm	2 x 16	32	2.54 mm	0.1 in	Through Hole	15.24 mm	DIP ZIF (ZIP)	0.6 "	200 µin	5.08 µm	1 A	5.08 µm	200 µin	0.11 in	2.78 mm	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame
Aries Electronics 32-6574-16	Beryllium Copper	Beryllium Copper	UL94 V-0	Solder	0.1 in	2.54 mm	2 x 16	32	2.54 mm	0.1 in	Through Hole	15.24 mm	DIP ZIF (ZIP)	0.6 "	200 µin	5.08 µm	1 A	5.08 µm	200 µin	0.11 in	2.78 mm	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame