ESD-105 Series

Catalog

CONN SOCKET 10POS 0.1 GOLD PCB

Part	Termination	Contact Length - Post	Material Flammability Rating	Insulation Color	Mounting Type	Number of Positions	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Post	Number of Positions Loaded	Style	Contact Type	Number of Rows	Fastening Type	Insulation Height	Contact Finish Thickness - Mating	Pitch - Mating	Connector Type	Row Spacing - Mating	Contact Material	Insulation Material	Contact Shape	Contact Finish Thickness - Post
Samtec Inc. ESD-105-T-05	Solder	0.165 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Tin	All	Board	Female Socket	2	Push-Pull	0.5 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESD-105-G-08	Solder	0.365 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Gold	All	Board	Female Socket	2	Push-Pull	0.3 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular	10 µin
Samtec Inc. ESD-105-T-23	Solder	0.115 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Tin	All	Board	Female Socket	2	Push-Pull	0.3 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESD-105-T-04	Solder	0.253 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Tin	All	Board	Female Socket	2	Push-Pull	0.4 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESD-105-TT-03	Solder	0.153 in	UL94 V-0	Black	Through Hole	10	Tin	125 °C	-55 °C	Tin	All	Board	Female Socket	2	Push-Pull	0.3 in		0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESD-105-G-25	Solder	0.165 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Gold	All	Board	Female Socket	2	Push-Pull	0.5 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular	10 µin
Samtec Inc. ESD-105-G-23	Solder	0.115 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Gold	All	Board	Female Socket	2	Push-Pull	0.3 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular	10 µin
Samtec Inc. ESD-105-T-24	Solder	0.115 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Tin	All	Board	Female Socket	2	Push-Pull	0.4 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESD-105-G-24	Solder	0.115 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Gold	All	Board	Female Socket	2	Push-Pull	0.4 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular	10 µin
Samtec Inc. ESD-105-G-05	Solder	0.165 in	UL94 V-0	Black	Through Hole	10	Gold	125 °C	-55 °C	Gold	All	Board	Female Socket	2	Push-Pull	0.5 in	10 µin	0.1 in	Elevated Socket	0.1 in	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular	10 µin