Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Features | Pitch - Post | Pitch - Post | Termination | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Contact Material - Mating | Current Rating (Amps) | Material Flammability Rating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 30 Áin | 0.76 Ám | Beryllium Copper | 3.18 mm | 0.125 in | 0.1 in | 2.54 mm | 125 °C | -65 ░C | Closed Frame | 2.54 mm | 0.1 in | Solder | PGA ZIF (ZIP) | 200 µin | 5.08 µm | Through Hole | Beryllium Copper | 1 A | UL94 V-0 | Tin |