628-25 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK FOR 45MM BGA
| Part | Thermal Resistance | Package Cooled | Shape | Width | Fin Height | Power Dissipation | Type | Material Finish | Attachment Method | Material | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Included) Thermal Tape | Aluminum | 1.75 in |
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Included) Thermal Tape | Aluminum | 1.75 in |
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Not Included) Thermal Tape | Aluminum | 1.75 in |
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Included) Thermal Tape | Aluminum | 1.75 in |
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Included) Thermal Tape | Aluminum | 1.75 in |
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Included) Thermal Tape | Aluminum | 1.75 in |
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Included) Thermal Tape | Aluminum | 1.75 in |
Wakefield Thermal Solutions | 7 °C/W | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Pin Fins Square | 1.7 in | 0.25 in | 4.5 W | Top Mount | Black Anodized | Adhesive (Not Included) Thermal Tape | Aluminum | 1.75 in |