100-014 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish - Post	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Post	Row Spacing	Type	Termination	Mounting Type	Features	Contact Finish - Mating	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post (string_set)	Housing Material	Contact Material - Mating	Current Rating	Material Flammability Rating	Termination Post Length
3M Electronic Specialty 100-014-001	8 µin	Gold	0.1 in	125 °C	-65 °C	Brass	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Through Hole	Closed Frame Seal Tape	Gold	14	7	2	0.1 in	Flash	Flash	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	1 A	UL94 V-0	0.126 in
3M Electronic Specialty 100-014-000	8 µin	Gold	0.1 in	125 °C	-65 °C	Brass	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Through Hole	Open Frame	Gold	14	7	2	0.1 in	Flash	Flash	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	1 A	UL94 V-0	0.126 in
3M Electronic Specialty 100-014-050	8 µin	Gold	0.1 in	125 °C	-65 °C	Brass	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	Through Hole	Open Frame	Gold	14	7	2	0.1 in	Flash	Flash	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	1 A	UL94 V-0	0.126 in