23-0518 Series

Catalog

CONN SOCKET SIP 23POS GOLD

Part	Contact Finish - Mating	Mounting Type	Features	Contact Material - Mating	Contact Finish - Post	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Material Flammability Rating	Housing Material
Aries Electronics 23-0518-11H	Gold	Through Hole	Open Frame	Beryllium Copper	Gold	2.54 mm	0.1 in	3 A	Brass	10 çin	0.25 çm	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	SIP	10 çin	0.25 çm	1 x 23	23	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 23-0518-10H	Gold	Through Hole	Open Frame	Beryllium Copper	Tin	2.54 mm	0.1 in	3 A	Brass	10 çin	0.25 çm	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	SIP	200 µin	5.08 µm	1 x 23	23	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 23-0518-10T	Gold	Through Hole	Open Frame	Beryllium Copper	Tin	2.54 mm	0.1 in	3 A	Brass	10 çin	0.25 çm	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	SIP	200 µin	5.08 µm	1 x 23	23	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 23-0518-11	Gold	Through Hole	Open Frame	Beryllium Copper	Gold	2.54 mm	0.1 in	3 A	Brass	10 çin	0.25 çm	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	SIP	10 çin	0.25 çm	1 x 23	23	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)