CONN HEADER SMD 106POS 0.8MM
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Material | Contact Shape | Fastening Type | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Type | Contact Material | Material Flammability Rating | Mounting Type | Insulation Height [z] | Insulation Height [z] | Contact Length - Mating [x] | Contact Length - Mating [x] | Number of Positions Loaded | Insulation Color | Contact Finish - Post | Current Rating (Amps) | Termination | Contact Finish - Mating | Row Spacing - Mating | Row Spacing - Mating | Shrouding | Number of Rows | Connector Type | Number of Positions | Features | Insulation Height | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 10 çin | 0.25 çm | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | Push-Pull | 0.031 in | 0.8 mm | 3 µin | 0.076 µm | Male Pin | Phosphor Bronze | UL94 V-0 | Surface Mount | 0.055 in | 1.4 mm | 1.9 mm | 0.075 in | All | Black | Gold | 2.7 A | Solder | Gold | 1.2 mm | 0.047 in | Unshrouded | 2 | Header | 106 | |||
Samtec Inc. | 10 çin | 0.25 çm | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | Push-Pull | 0.031 in | 0.8 mm | Male Pin | Phosphor Bronze | UL94 V-0 | Surface Mount | 0.055 in | 1.4 mm | 1.9 mm | 0.075 in | All | Black | Gold | 2.7 A | Solder | Gold | 1.2 mm | 0.047 in | Unshrouded | 2 | Header | 106 | Board Guide | ||||
Samtec Inc. | 10 çin | 0.25 çm | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Square | Push-Pull | 0.031 in | 0.8 mm | 3 µin | 0.076 µm | Male Pin | Phosphor Bronze | UL94 V-0 | Surface Mount Right Angle | 1.9 mm | 0.075 in | All | Black | Gold | 2.7 A | Solder | Gold | 1.2 mm | 0.047 in | Unshrouded | 2 | Header | 106 | 3.05 mm | 0.12 in |