CONN SOCKET PGA ZIF GOLD
| Part | Termination Post Length | Termination Post Length | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Finish - Mating | Contact Finish - Post | Features | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Type | Current Rating (Amps) | Pitch - Post | Pitch - Post | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3.18 mm | 0.125 in | Solder | 200 µin | 5.08 µm | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Beryllium Copper | Gold | Tin | Closed Frame | Beryllium Copper | 30 Áin | 0.76 Ám | Through Hole | PGA ZIF (ZIP) | 1 A | 2.54 mm | 0.1 in | UL94 V-0 |
Aries Electronics | 3.18 mm | 0.125 in | Solder | 200 µin | 5.08 µm | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Beryllium Copper | Gold | Tin | Closed Frame | Beryllium Copper | 30 Áin | 0.76 Ám | Through Hole | PGA ZIF (ZIP) | 1 A | 2.54 mm | 0.1 in | UL94 V-0 |
Aries Electronics | 3.18 mm | 0.125 in | Solder | 200 µin | 5.08 µm | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Beryllium Copper | Gold | Tin | Closed Frame | Beryllium Copper | 30 Áin | 0.76 Ám | Through Hole | PGA ZIF (ZIP) | 1 A | 2.54 mm | 0.1 in | UL94 V-0 |
Aries Electronics | 3.18 mm | 0.125 in | Solder | 200 µin | 5.08 µm | 125 °C | -65 ░C | 0.1 in | 2.54 mm | Beryllium Copper | Gold | Tin | Closed Frame | Beryllium Copper | 30 Áin | 0.76 Ám | Through Hole | PGA ZIF (ZIP) | 1 A | 2.54 mm | 0.1 in | UL94 V-0 |