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CONN IC DIP SOCKET ZIF 28POS GLD
| Part | Mounting Type | Contact Finish - Mating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Housing Material | Number of Positions or Pins (Grid) | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Termination | Contact Material - Mating | Current Rating (Amps) | Contact Material - Post | Contact Finish - Post | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | Gold | Closed Frame | 10 çin | 0.25 çm | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | 28 | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | Solder | Beryllium Copper | 1 A | Beryllium Copper | Gold | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 10 çin | 0.25 çm | 2.54 mm | 0.1 in |