32-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Current Rating (Amps)	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Post	Pitch - Post	Type	Type	Type	Termination	Termination Post Length	Termination Post Length	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Mounting Type	Contact Material - Mating	Housing Material	Contact Material - Post
Aries Electronics 32-3574-11	1 A	Closed Frame	1.27 µm	50 µin	2 x 16	32	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	Solder	0.11 in	2.78 mm	Nickel Boron	1.27 µm	50 µin	UL94 V-0	0.1 in	2.54 mm	Nickel Boron	Through Hole	Beryllium Nickel	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Nickel
Aries Electronics 32-3574-10	1 A	Closed Frame	1.27 µm	50 µin	2 x 16	32	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	Solder	0.11 in	2.78 mm	Nickel Boron	1.27 µm	50 µin	UL94 V-0	0.1 in	2.54 mm	Nickel Boron	Through Hole	Beryllium Nickel	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Nickel