32-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Termination Post Length	Current Rating	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Post	Pitch - Mating	Contact Finish Thickness - Mating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Housing Material	Pitch - Post	Contact Finish - Post	Termination	Mounting Type	Row Spacing	Type	Contact Finish - Mating	Features	Contact Material - Post
Aries Electronics 32-3574-11	0.11 in	1 A	UL94 V-0	Beryllium Nickel	50 µin	0.1 in	50 µin	16	32	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Nickel Boron	Solder	Through Hole	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Beryllium Nickel
Aries Electronics 32-3574-18	0.11 in	1 A	UL94 V-0	Beryllium Nickel	50 µin	0.1 in	50 µin	16	32	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Nickel Boron	Solder	Through Hole	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Beryllium Nickel
Aries Electronics 32-3574-10	0.11 in	1 A	UL94 V-0	Beryllium Nickel	50 µin	0.1 in	50 µin	16	32	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Nickel Boron	Solder	Through Hole	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Beryllium Nickel