CONN IC DIP SOCKET ZIF 48POS
| Part | Termination | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Housing Material | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Type | Type | Type | Features | Current Rating (Amps) | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Contact Finish - Post | Contact Finish - Mating | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6551-16 | Solder | 48 | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS), Glass Filled | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Closed Frame | 1 A | Beryllium Copper | 1.27 µm | 50 µin | Through Hole | Nickel Boron | Nickel Boron | Beryllium Copper | 1.27 µm | 50 µin | UL94 V-0 |
Aries Electronics 48-6551-10 | Solder | 48 | 2.54 mm | 0.1 in | Polyphenylene Sulfide (PPS), Glass Filled | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | Closed Frame | 1 A | Beryllium Copper | 5.08 µm | 200 µin | Through Hole | Tin | Beryllium Copper | 5.08 µm | 200 µin | UL94 V-0 |