CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Housing Material | Pitch - Post | Pitch - Post | Termination | Type | Type | Type | Mounting Type | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Material Flammability Rating | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Number of Positions or Pins (Grid) | Contact Finish - Mating | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics  | 1 A  | 0.11 in  | 2.78 mm  | Polyphenylene Sulfide (PPS)  Glass Filled  | 2.54 mm  | 0.1 in  | Solder  | 15.24 mm  | DIP  ZIF (ZIP)  | 0.6 "  | Through Hole  | Beryllium Copper  | 5.08 µm  | 200 µin  | Closed Frame  | UL94 V-0  | Tin  | 0.1 in  | 2.54 mm  | 200 µin  | 5.08 µm  | Beryllium Copper  | 48  | |
Aries Electronics  | 1 A  | 0.11 in  | 2.78 mm  | Polyphenylene Sulfide (PPS)  Glass Filled  | 2.54 mm  | 0.1 in  | Solder  | 15.24 mm  | DIP  ZIF (ZIP)  | 0.6 "  | Through Hole  | Beryllium Copper  | 1.27 µm  | 50 µin  | Closed Frame  | UL94 V-0  | Nickel Boron  | 0.1 in  | 2.54 mm  | 50 µin  | 1.27 µm  | Beryllium Copper  | 48  | Nickel Boron  |