2354154 Series
Manufacturer: TE Connectivity AMP Connectors
Beta
⌘K
TE CONNECTIVITY PCIEG4,SMT,V,164P, 30U,ML,HT,TAB
| Part | Mounting Type | Contact Finish Thickness | Gender | Number of Rows | Color | Features | Contact Material | Operating Temperature (Min) | Operating Temperature (Max) | Contact Type | Read Out | Contact Finish | Pitch | Card Thickness | Termination | Number of Positions | Card Type | Material - Insulation | Contact Finish Thickness (string set options) | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 TE Connectivity AMP Connectors | Surface Mount | 30 µin | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | ||
 TE Connectivity AMP Connectors | Surface Mount | 30 µin | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | ||
 TE Connectivity AMP Connectors | Surface Mount | 30 µin | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | ||
TE Connectivity AMP Connectors | Surface Mount | 15 µin | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | ||
TE Connectivity AMP Connectors | Surface Mount | 15 µin | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | ||
TE Connectivity AMP Connectors | Surface Mount | 15 µin | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | ||
TE Connectivity AMP Connectors | Surface Mount | 0 | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | Flash | Flash |
TE Connectivity AMP Connectors | Surface Mount | 0 | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | Flash | Flash |
TE Connectivity AMP Connectors | Surface Mount | 0 | Female | 2 | Black | Board Guide Locking Ramp Solder Retention | Copper Alloy | -40 °C | 85 °C | Cantilever | Dual | Gold | 0.039 in | 0.062 in | Solder | 164 | PCI Express™ | LCP Liquid Crystal Polymer | Flash | Flash |