TMM-119 Series

Catalog

2MM TERMINAL STRIP

Part	Insulation Height	Insulation Height	Mounting Type	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating [x]	Pitch - Mating [x]	Insulation Material	Number of Positions	Contact Shape	Current Rating (Amps)	Connector Type	Contact Length - Mating	Contact Length - Mating	Number of Positions Loaded	Contact Length - Post [x]	Contact Length - Post [x]	Style	Overall Contact Length	Overall Contact Length	Insulation Color	Fastening Type	Shrouding	Number of Rows	Contact Material	Contact Finish - Mating	Termination	Row Spacing - Mating	Row Spacing - Mating	Contact Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Post	Contact Length - Post	Features	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. TMM-119-03-L-D	1.5 mm	0.059 "	Through Hole	Tin	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	38	Square	3.2 A	Header	4 mm	0.157 in	All	0.106 in	2.69 mm	Board to Board Cable	8.2 mm	0.323 in	Black	Push-Pull	Unshrouded	2	Phosphor Bronze	Gold	Solder	0.079 in	2 mm	Male Pin	10 çin	0.25 çm
Samtec Inc. TMM-119-01-S-S	1.5 mm	0.059 "	Through Hole	Tin	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	19	Square	3.2 A	Header	3.2 mm	0.126 "	All			Board to Board Cable	8.2 mm	0.323 in	Black	Push-Pull	Unshrouded	1	Phosphor Bronze	Gold	Solder			Male Pin	30 Áin	0.76 Ám	3.5 mm	0.138 in
Samtec Inc. TMM-119-01-S-D-SM-A-P-TR	1.5 mm	0.059 "	Surface Mount	Tin	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	38	Square	3.2 A	Header	3.2 mm	0.126 "	All			Board to Board Cable			Black	Push-Pull	Unshrouded	2	Phosphor Bronze	Gold	Solder	0.079 in	2 mm	Male Pin	30 Áin	0.76 Ám			Board Guide Pick and Place	UL94 V-0
Samtec Inc. TMM-119-02-G-S	1.5 mm	0.059 "	Through Hole	Gold	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	19	Square	3.2 A	Header			All			Board to Board Cable	8.2 mm	0.323 in	Black	Push-Pull	Unshrouded	1	Phosphor Bronze	Gold	Solder			Male Pin	20 µin	0.51 µm	3 mm	0.118 in			3 µin	0.076 µm
Samtec Inc. TMM-119-01-S-S-RA	2 mm	0.079 in	Through Hole Right Angle	Tin	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	19	Square	3.2 A	Header	3.2 mm	0.126 "	All	0.12 in	3.05 mm	Board to Board Cable			Black	Push-Pull	Unshrouded	1	Phosphor Bronze	Gold	Solder			Male Pin	30 Áin	0.76 Ám
Samtec Inc. TMM-119-01-G-D	1.5 mm	0.059 "	Through Hole	Gold	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	38	Square	3.2 A	Header	3.2 mm	0.126 "	All			Board to Board Cable	8.2 mm	0.323 in	Black	Push-Pull	Unshrouded	2	Phosphor Bronze	Gold	Solder	0.079 in	2 mm	Male Pin	20 µin	0.51 µm	3.5 mm	0.138 in			3 µin	0.076 µm
Samtec Inc. TMM-119-02-G-Q	1.5 mm	0.059 "	Through Hole	Gold	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	76	Square	3.2 A	Header			All			Board to Board Cable	8.2 mm	0.323 in	Black	Push-Pull	Unshrouded		Phosphor Bronze	Gold	Solder	0.079 in	2 mm	Male Pin	20 µin	0.51 µm	3 mm	0.118 in			3 µin	0.076 µm
Samtec Inc. TMM-119-01-L-S	1.5 mm	0.059 "	Through Hole	Tin	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	19	Square	3.2 A	Header	3.2 mm	0.126 "	All			Board to Board Cable	8.2 mm	0.323 in	Black	Push-Pull	Unshrouded	1	Phosphor Bronze	Gold	Solder			Male Pin	10 çin	0.25 çm	3.5 mm	0.138 in
Samtec Inc. TMM-119-03-G-S	1.5 mm	0.059 "	Through Hole	Gold	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	19	Square	3.2 A	Header	4 mm	0.157 in	All	0.106 in	2.69 mm	Board to Board Cable	8.2 mm	0.323 in	Black	Push-Pull	Unshrouded	1	Phosphor Bronze	Gold	Solder			Male Pin	20 µin	0.51 µm					3 µin	0.076 µm
Samtec Inc. TMM-119-06-S-D-SM	1.5 mm	0.059 "	Surface Mount	Tin	-55 °C	125 °C	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	38	Square	3.2 A	Header	4.27 mm	0.168 in	All			Board to Board Cable			Black	Push-Pull	Unshrouded	2	Phosphor Bronze	Gold	Solder	0.079 in	2 mm	Male Pin	30 Áin	0.76 Ám				UL94 V-0