TFM-106 Series

Catalog

CONN HEADER VERT 6POS 1.27MM

Part	Number of Positions	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height	Insulation Height	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Color	Termination	Material Flammability Rating	Shrouding	Features	Number of Rows	Contact Type	Fastening Type	Insulation Material	Style	Mounting Type	Contact Finish - Post	Number of Positions Loaded	Contact Material	Contact Finish - Mating	Contact Shape	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Voltage Rating	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Mating	Contact Length - Mating	Connector Type	Row Spacing - Mating	Row Spacing - Mating
Samtec Inc. TFM-106-01-L-S-WT	6	15 µin	0.38 µm	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall	Solder Retention	1	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A 3.2 A	275 VAC	0.078 in	1.98 mm	3.33 mm	0.131 in	Header
Samtec Inc. TFM-106-02-L-S-LC	6	15 µin	0.38 µm	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall		1	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Surface Mount	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC			3.33 mm	0.131 in	Header
Samtec Inc. TFM-106-01-S-S-LC	6	30 Áin	0.76 Ám	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall		1	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC	0.078 in	1.98 mm	3.33 mm	0.131 in	Header
Samtec Inc. TFM-106-02-L-D-A-K-TR	12	15 µin	0.38 µm	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall	Board Guide Pick and Place	2	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Surface Mount	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC			3.33 mm	0.131 in	Header	0.05 in	1.27 mm
Samtec Inc. TFM-106-01-F-S	6	3 µin	0.076 µm	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall		1	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC	0.078 in	1.98 mm	3.33 mm	0.131 in	Header
Samtec Inc. TFM-106-02-STL-D-LC	12	30 Áin	0.76 Ám	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall		2	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Surface Mount	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC			3.33 mm	0.131 in	Header	0.05 in	1.27 mm
Samtec Inc. TFM-106-02-L-D-LC-P	12	15 µin	0.38 µm	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall	Board Lock Pick and Place	2	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Surface Mount	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC			3.33 mm	0.131 in	Header	0.05 in	1.27 mm
Samtec Inc. TFM-106-01-L-D-K	12	15 µin	0.38 µm	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall	Pick and Place	2	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC	0.078 in	1.98 mm	3.33 mm	0.131 in	Header	0.05 in	1.27 mm
Samtec Inc. TFM-106-02-S-S-TR	6	30 Áin	0.76 Ám	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall		1	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Surface Mount	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC			3.33 mm	0.131 in	Header
Samtec Inc. TFM-106-02-S-D-K-TR	12	30 Áin	0.76 Ám	5.6 mm	0.22 in	-55 °C	125 °C	Black	Solder	UL94 V-0	Shrouded - 4 Wall	Pick and Place	2	Male Pin	Push-Pull	Liquid Crystal Polymer (LCP)	Board to Board Cable	Surface Mount	Tin	All	Phosphor Bronze	Gold	Square	0.05 in	1.27 mm	2.9 A	275 VAC			3.33 mm	0.131 in	Header	0.05 in	1.27 mm