28-650 Series

Catalog

SOCKET ADAPTER SOIC TO 28DIP 0.6

Part	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Number of Pins	Contact Finish - Post	Pitch - Post	Pitch - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End)	Termination	Board Material	Termination Post Length	Termination Post Length	Contact Finish - Mating	Contact Material - Post [custom]	Material	Number of Positions	Proto Board Type	Package Accepted	Pitch [x]	Pitch [x]	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [x]	Board Thickness	Board Thickness	Board Thickness	Housing Material	Type	Type	Type	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Current Rating (Amps)	Pitch - Mating	Material Flammability Rating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 28-650000-11-RC-P	Through Hole	10 çin	0.25 çm	0.05 in	1.27 mm	28	Gold	2.54 mm	0.1 in	0.6 in	DIP	15.24 mm	SOIC	Solder	FR4 Epoxy Glass	3.18 mm	0.125 in	Gold	Brass
Aries Electronics 28-650000-11-RC																				FR4 Epoxy Glass	28	SMD to DIP	SOIC	0.05 in	1.27 mm	0.7 in	71.12 mm	17.78 mm	2.8 in	0.062 in	0.0625 in	1.57 mm
Aries Electronics 28-6508-211	Through Hole	10 çin	0.25 çm	2.54 mm			Gold	2.54 mm	0.1 in					Wire Wrap		12.7 mm	0.5 in	Gold	Brass														Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	125 °C	Beryllium Copper	3 A	0.1 in	UL94 V-0	Open Frame	30 Áin	0.76 Ám
Aries Electronics 28-6503-31	Through Hole	10 çin	0.25 çm	2.54 mm			Gold	2.54 mm	0.1 in					Wire Wrap		12.7 mm	0.5 in	Gold															Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	125 °C	Beryllium Copper	3 A	0.1 in	UL94 V-0	Closed Frame	10 çin	0.25 çm	Phosphor Bronze
Aries Electronics 28-6501-21	Through Hole	10 çin	0.25 çm	2.54 mm			Gold	2.54 mm	0.1 in					Wire Wrap		10.41 mm	0.41 in	Gold															Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	125 °C	Phosphor Bronze	1.5 A	0.1 in	UL94 V-0	Closed Frame	10 çin	0.25 çm	Phosphor Bronze
Aries Electronics 28-6503-30	Through Hole	200 µin	5.08 µm	2.54 mm			Tin	2.54 mm	0.1 in					Wire Wrap		12.7 mm	0.5 in	Gold															Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	105 ░C	Beryllium Copper	3 A	0.1 in	UL94 V-0	Closed Frame	10 çin	0.25 çm	Phosphor Bronze
Aries Electronics 28-6508-202	Through Hole	200 µin	5.08 µm	2.54 mm			Tin	2.54 mm	0.1 in					Wire Wrap				Gold	Brass														Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	105 ░C	Beryllium Copper	3 A	0.1 in	UL94 V-0	Open Frame	30 Áin	0.76 Ám		0.36 in	9.14 mm
Aries Electronics 28-6508-21	Through Hole	10 çin	0.25 çm	2.54 mm			Gold	2.54 mm	0.1 in					Wire Wrap		12.7 mm	0.5 in	Gold	Brass														Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	125 °C	Beryllium Copper	3 A	0.1 in	UL94 V-0	Open Frame	30 Áin	0.76 Ám
Aries Electronics 28-6501-31	Through Hole	10 çin	0.25 çm	2.54 mm			Gold	2.54 mm	0.1 in					Wire Wrap		17.52 mm	0.69 in	Gold															Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	125 °C	Phosphor Bronze	1.5 A	0.1 in	UL94 V-0	Closed Frame	10 çin	0.25 çm	Phosphor Bronze
Aries Electronics 28-6508-201	Through Hole	200 µin	5.08 µm	2.54 mm			Tin	2.54 mm	0.1 in					Wire Wrap				Gold	Brass														Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	28	-55 °C	105 ░C	Beryllium Copper	3 A	0.1 in	UL94 V-0	Open Frame	30 Áin	0.76 Ám		0.36 in	9.14 mm