A3PE600 Series

Ultra Low Density FPGAs

Catalog

Ultra Low Density FPGAs

Part	Package Length	Package Name	Package Width	Number of Gates	Total RAM Bits	Number of I/O	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Operating Temperature (Max)	Operating Temperature (Min)	Mounting Type	Package / Case
Microchip Technology A3PE600-2FG256I	17 mm	256-FPBGA	17 mm	600000	110592 bits	165	1.575 V	1.425 V	100 °C	-40 °C	Surface Mount	256-LBGA
Microchip Technology A3PE600L-FGG484M	23 mm	484-FPBGA	23 mm	600000	110592 bits	270	1.575 V	1.425 V	125 °C	-55 °C	Surface Mount	484-BGA
Microchip Technology A3PE600-2FG484I	23 mm	484-FPBGA	23 mm	600000	110592 bits	270	1.575 V	1.425 V	100 °C	-40 °C	Surface Mount	484-BGA
Microchip Technology A3PE600-2FGG256I	17 mm	256-FPBGA	17 mm	600000	110592 bits	165	1.575 V	1.425 V	100 °C	-40 °C	Surface Mount	256-LBGA
Microchip Technology A3PE600-FGG256I	17 mm	256-FPBGA	17 mm	600000	110592 bits	165	1.575 V	1.425 V	100 °C	-40 °C	Surface Mount	256-LBGA
Microchip Technology A3PE600-2FGG484I	23 mm	484-FPBGA	23 mm	600000	110592 bits	270	1.575 V	1.425 V	100 °C	-40 °C	Surface Mount	484-BGA
Microchip Technology A3PE600-FGG484	23 mm	484-FPBGA	23 mm	600000	110592 bits	270	1.575 V	1.425 V	85 °C	0 °C	Surface Mount	484-BGA
Microchip Technology A3PE600-FGG256	17 mm	256-FPBGA	17 mm	600000	110592 bits	165	1.575 V	1.425 V	85 °C	0 °C	Surface Mount	256-LBGA
Microchip Technology A3PE600-1FG256	17 mm	256-FPBGA	17 mm	600000	110592 bits	165	1.575 V	1.425 V	85 °C	0 °C	Surface Mount	256-LBGA
Microchip Technology A3PE600-FGG484I	23 mm	484-FPBGA	23 mm	600000	110592 bits	270	1.575 V	1.425 V	100 °C	-40 °C	Surface Mount	484-BGA

Catalog

Ultra Low Density FPGAs

Description

ProASIC3 offers high performance in ultra low density FPGAs, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features. Key Features • Low TOC (total cost of ownership) • 1.2 V to 1.5 V core voltage support • Innovative Flash\*Freeze technology for instantaneous switching from active to static mode • Proven Security • Protection from Overbuilding and Cloning • Exceptional Reliability