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CONN IC DIP SOCKET 28POS GOLD
| Part | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Type | Type | Type | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish - Mating | Contact Material - Post [custom] | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame Elevated | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) | Through Hole | 105 ░C | -55 °C | Beryllium Copper | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 3.56 mm | 0.14 in | 3 A | Gold | Brass | Gold | 28 | 10 çin | 0.25 çm | Solder | UL94 V-0 |