CONN EDGE DUAL FMALE 40POS 0.031
| Part | Features | Contact Finish | Pitch [x] | Pitch [x] | Mounting Type | Card Thickness | Card Thickness | Number of Positions | Material - Insulation | Number of Rows | Color | Read Out | Contact Finish Thickness | Contact Finish Thickness | Termination | Contact Material | Card Type | Operating Temperature [Min] | Operating Temperature [Max] | Gender | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Contact Type | Number of Positions [custom] | Number of Positions [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Board Guide | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 10 Áin | 0.25 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | ||||||
Samtec Inc. | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 30 Áin | 0.76 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever | |||
Samtec Inc. | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.093 in | 2.36 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 30 Áin | 0.76 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever | |||
Samtec Inc. | Board Guide Solder Retention | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 30 Áin | 0.76 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever | ||
Samtec Inc. | Board Guide Solder Retention | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 30 Áin | 0.76 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever | ||
Samtec Inc. | Board Guide | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 10 Áin | 0.25 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever | ||
Samtec Inc. | Board Guide Locking Ramp | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 30 Áin | 0.76 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever | ||
Samtec Inc. | Board Guide | Gold | 0.8 mm | 0.031 in | Surface Mount Through Hole | 0.062 in | 1.57 mm | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 10 Áin | 0.25 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | Cantilever | 40 | 2 | ||||
Samtec Inc. | Board Guide | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 30 Áin | 0.76 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever | ||
Samtec Inc. | Board Guide Board Lock | Gold | 0.8 mm | 0.031 in | Surface Mount | 0.062 in | 1.57 mm | 40 | Liquid Crystal Polymer (LCP) | 2 | Black | Dual | 10 Áin | 0.25 Ám | Solder | Beryllium Copper | Non Specified - Dual Edge | -55 °C | 125 °C | Female | 20 | 20 | 20 | Cantilever |