CONN HEADER SMD 160POS 0.8MM
| Part | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Length - Mating [x] | Contact Length - Mating [x] | Termination | Mounting Type | Connector Type | Insulation Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Height [z] | Insulation Height [z] | Shrouding | Contact Finish - Mating | Row Spacing - Mating | Row Spacing - Mating | Contact Type | Contact Shape | Contact Material | Fastening Type | Features | Number of Rows | Number of Positions Loaded | Insulation Color | Current Rating (Amps) | Material Flammability Rating | Number of Positions | Contact Finish - Post | Contact Length - Mating | Contact Length - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | 1.9 mm | 0.075 in | Solder | Surface Mount | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | Board Guide | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | ||||||
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | 1.9 mm | 0.075 in | Solder | Surface Mount | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | End Shrouds | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | ||||||
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | Solder | Surface Mount | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | Pick and Place | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | 4.45 mm | 0.175 in | ||||||
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | 1.9 mm | 0.075 in | Solder | Surface Mount | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | |||||||
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | 1.9 mm | 0.075 in | Solder | Surface Mount | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | Board Lock End Shrouds | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | ||||||
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | 1.9 mm | 0.075 in | Solder | Surface Mount | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | Board Guide End Shrouds | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | ||||||
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | 1.9 mm | 0.075 in | Solder | Surface Mount | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | 0.055 in | 1.4 mm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | 3 µin | 0.076 µm | |||||
Samtec Inc. | 0.031 in | 0.8 mm | -55 °C | 125 °C | 1.9 mm | 0.075 in | Solder | Surface Mount Right Angle | Header | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | Unshrouded | Gold | 1.2 mm | 0.047 in | Male Pin | Square | Phosphor Bronze | Push-Pull | 2 | All | Black | 2.7 A | UL94 V-0 | 160 | Gold | 3 µin | 0.076 µm | 3.05 mm | 0.12 in |