655-26 Series
Manufacturer: Wakefield Thermal Solutions
Beta
⌘K
HEATSINK FOR 40MM BGA
| Part | Shape | Fin Height | Length | Material Finish | Attachment Method | Package Cooled | Power Dissipation | Thermal Resistance | Width | Type | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|
 Wakefield Thermal Solutions | Pin Fins Square | 0.26 in | 1.6 in | Black Anodized | Adhesive (Not Included) Thermal Tape | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 5 W | 3 °C/W | 1.6 in | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 0.26 in | 1.6 in | Black Anodized | Adhesive (Not Included) Thermal Tape | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 5 W | 3 °C/W | 1.6 in | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 0.26 in | 1.6 in | Black Anodized | Adhesive (Not Included) Thermal Tape | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 5 W | 3 °C/W | 1.6 in | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 0.26 in | 1.6 in | Black Anodized | Adhesive (Not Included) Thermal Tape | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 5 W | 3 °C/W | 1.6 in | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 0.26 in | 1.6 in | Black Anodized | Adhesive (Not Included) Thermal Tape | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 5 W | 3 °C/W | 1.6 in | Top Mount | Aluminum |
Wakefield Thermal Solutions | Pin Fins Square | 0.26 in | 1.6 in | Black Anodized | Adhesive (Not Included) Thermal Tape | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 5 W | 3 °C/W | 1.6 in | Top Mount | Aluminum |