HIGH-SIDE POWER SWITCH
| Part | Output Type | Current - Output (Max) [Max] | Number of Outputs | Supplier Device Package | Input Type | Switch Type | Package / Case | Output Configuration | Rds On (Typ) | Operating Temperature [Min] | Operating Temperature [Max] | Interface | Ratio - Input:Output [custom] | Voltage - Supply (Vcc/Vdd) | Voltage - Load [Max] | Voltage - Load [Min] | Features | Mounting Type | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology  | P-Channel  | 2 A  | 1  | SC-70-6  | Non-Inverting  | General Purpose  | 6-TSSOP  SC-88  SOT-363  | High Side  | 77 mOhm  | -40 °C  | 125 ¯C  | On/Off  | 1:1  | 5.5 V  | 1.7 V  | Slew Rate Controlled  | Surface Mount  | |
Microchip Technology  | P-Channel  | 2 A  | 1  | SC-70-6  | Non-Inverting  | General Purpose  | 6-TSSOP  SC-88  SOT-363  | High Side  | 77 mOhm  | -40 °C  | 125 °C  | On/Off  | 1:1  | 5.5 V  | 1.7 V  | Slew Rate Controlled  | Surface Mount  | |
Microchip Technology  | P-Channel  | 2 A  | 1  | 4-TMLF® (1.2x1.6)  | General Purpose  | 4-TMLF®  4-UFDFN Exposed Pad  | High Side  | 85 mOhm  | -40 °C  | 125 °C  | On/Off  | 1:1  | 5.5 V  | 1.7 V  | Slew Rate Controlled  | Surface Mount  |