EdgeLineESP, Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 54 Circuits, 30A Power Module, 2 Power Circuits
EdgeLineESP, Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 54 Circuits, 30A Power Module, 2 Power Circuits
EdgeLineESP, Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 2.36mm PCB Thickness, 54 Circuits, 30A Power Module, 2 Power Circuits
| Part | Gender | Color | Pitch | Termination Rows | Termination | Number of Positions | Operating Temperature (Min) | Operating Temperature (Max) | Read Out | Mounting Type | Card Thickness | Contact Finish Thickness | Card Type | Contact Finish | Contact Type | Contact Material | Number of Rows | Material - Insulation | Number of Bay |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | Female | Black | 0.031 in | 2 rows | Press-Fit | 76 150 | -40 °C | 105 °C | Single | Through Hole | 0.093 in | 30 µin | Dual Edge Non Specified | Gold | Cantilever | Copper Alloy | 2 | Thermoplastic | |
Molex | Female | Black | 0.031 in | 2 rows | Press-Fit | 27 54 | -40 °C | 105 °C | Dual | Through Hole | 0.093 in | 30 µin | Dual Edge Non Specified | Gold | Cantilever | Copper Alloy | 2 | Thermoplastic | 1 |