CONN IC DIP SOCKET 26POS GOLD
| Part | Features | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Type | Type | Type | Termination Post Length | Termination Post Length | Contact Material - Post [custom] | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Pitch - Post | Pitch - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | Solder | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | 3.56 mm | 0.14 in | Brass | Beryllium Copper | 0.1 in | 2.54 mm | Tin | 30 Áin | 0.76 Ám | Gold | UL94 V-0 | 200 µin | 5.08 µm | 3 A | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) |