262-75 Series
Manufacturer: Wakefield Thermal Solutions
HEAT SINK, SQUARE, PCB, DB EXTRUSIONS, 40 °C/W, TO-220, 14.5 MM, 13.41 MM, 19 MM
| Part | Type | Width | Material Finish | Fin Height | Thermal Resistance | Material | Package Cooled | Power Dissipation | Length | Shape | Attachment Method |
|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | Board Level | 0.57 in | Black Anodized | 0.5 in | 10 °C/W 26.7 °C/W | Aluminum | TO-220 | 3 W | 0.75 in | Fins Rectangular | PC Pin Press Fit |
Wakefield Thermal Solutions | Board Level Vertical | 0.57 in | Black Anodized | 0.5 in | 10 °C/W 26.7 °C/W | Aluminum | TO-220 | 3 W | 0.75 in | Fins Rectangular | PC Pin Press Fit |
Wakefield Thermal Solutions | Board Level | 0.57 in | Black Anodized | 0.5 in | 10 °C/W 26.7 °C/W | Aluminum | TO-220 | 3 W | 0.75 in | Fins Rectangular | PC Pin Press Fit |
Wakefield Thermal Solutions | Board Level Vertical | 0.57 in | Black Anodized | 0.5 in | 10 °C/W 26.7 °C/W | Aluminum | TO-220 | 3 W | 0.75 in | Fins Rectangular | PC Pin Press Fit |