WAVE-425 Series
Manufacturer: Wakefield Thermal Solutions
Beta
⌘K
LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES
| Part | Width | Package Cooled | Fin Height | Thermal Resistance | Attachment Method | Type | Material | Material Finish | Length | Shape |
|---|---|---|---|---|---|---|---|---|---|---|
 Wakefield Thermal Solutions | 1.673 in | BGA | 0.461 in | 3.4 °C/W | Clip | Board Level | Aluminum Alloy | Black Anodized | 1.673 in | Angled Fins Square |
Wakefield Thermal Solutions | 1.673 in | BGA | 0.461 in | 3.4 °C/W | Clip | Board Level | Aluminum Alloy | Black Anodized | 1.673 in | Angled Fins Square |