HEATSINK FORGED BLK ANO TOP MNT
| Part | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | Length [x] | Length [x] | Width | Width [y] | Shelf Life | Shape | Material | Attachment Method | Type | Thermal Resistance @ Natural | Fin Height | Fin Height | Fin Height [z] | Fin Height [z] | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components  | ASIC  BGA  CPU  LGA  | 3.92 °C/W  | Black Anodized  | 22.61 mm  | 0.89 in  | 22.61 mm  | 0.89 "  | 24 Months  | Fins  Square  | Aluminum Alloy  | Thermal Tape  Adhesive (Included)  | Top Mount  | 13.42 °C/W  | ||||
Tusonix a Subsidiary of CTS Electronic Components  | ASIC  BGA  CPU  LGA  | 2.82 °C/W  | Black Anodized  | 22.61 mm  | 0.89 in  | 22.61 mm  | 0.89 "  | 24 Months  | Fins  Square  | Aluminum Alloy  | Thermal Tape  Adhesive (Included)  | Top Mount  | 10.82 °C/W  | 1.283 "  | 32.6 mm  | ||
Tusonix a Subsidiary of CTS Electronic Components  | ASIC  BGA  CPU  LGA  | 3.52 °C/W  | Black Anodized  | 22.61 mm  | 0.89 in  | 22.61 mm  | 0.89 "  | 24 Months  | Fins  Square  | Aluminum Alloy  | Thermal Tape  Adhesive (Included)  | Top Mount  | 12.52 °C/W  | 0.89 in  | 22.61 mm  | ||
Tusonix a Subsidiary of CTS Electronic Components  | ASIC  BGA  CPU  LGA  | 4.62 °C/W  200 LFM  | Black Anodized  | 22.61 mm  | 0.89 in  | 22.61 mm  | 0.89 "  | 24 Months  | Fins  Square  | Aluminum Alloy  | Thermal Tape  Adhesive (Included)  | Top Mount  | 14.12 °C/W  | ||||
Tusonix a Subsidiary of CTS Electronic Components  | ASIC  BGA  CPU  LGA  | 4.22 °C/W  | Black Anodized  | 22.61 mm  | 0.89 in  | 22.61 mm  | 0.89 "  | 24 Months  | Fins  Square  | Aluminum Alloy  | Thermal Tape  Adhesive (Included)  | Top Mount  | 13.72 °C/W  | 0.575 in  | 14.6 mm  |