623 Series

Catalog

HEAT SINK, SQUARE, PCB, FOR METAL CASED SEMICONDUCTORS, 3.47 °C/W, TO-3, 120.6 MM, 11.71 MM, 121 MM

Part	Power Dissipation	Thermal Resistance	Shape	Material	Material Finish	Fin Height	Type	Length	Package Cooled	Attachment Method	Width
Wakefield Thermal Solutions 623K	15 W	1.5 °C/W 3.5 °C/W	Fins Rectangular	Aluminum	Black Anodized	0.461 in	Board Level	3 "	TO-3	Press Fit	4.75 in
Wakefield Thermal Solutions 623K	15 W	1.5 °C/W 3.5 °C/W	Fins Rectangular	Aluminum	Black Anodized	0.461 in	Board Level	3 "	TO-3	Press Fit	4.75 in