CONN SOCKET PGA ZIF GOLD
| Part | Contact Material - Mating | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Features | Contact Finish - Mating | Contact Material - Post | Material Flammability Rating | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Solder | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | 125 °C | -65 ░C | 1 A | Through Hole | 200 µin | 5.08 µm | Tin | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Closed Frame | Gold | Beryllium Copper | UL94 V-0 | PGA ZIF (ZIP) |
Aries Electronics | Beryllium Copper | Solder | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | 125 °C | -65 ░C | 1 A | Through Hole | 200 µin | 5.08 µm | Tin | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Closed Frame | Gold | Beryllium Copper | UL94 V-0 | PGA ZIF (ZIP) |