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CONN IC DIP SOCKET 20POS GOLD
| Part | Material Flammability Rating | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Housing Material | Current Rating (Amps) | Mounting Type | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish - Mating | Termination | Number of Positions or Pins (Grid) | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | Tin | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | Through Hole | Open Frame | 10 çin | 0.25 çm | 0.4 in | 10.16 mm | DIP | Brass | 2.54 mm | 0.1 in | Beryllium Copper | Gold | Solder | 20 | 3.18 mm | 0.125 in | 200 µin | 5.08 µm |
Aries Electronics | UL94 V-0 | Tin | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | 3 A | Through Hole | Open Frame | 10 çin | 0.25 çm | 0.4 in | 10.16 mm | DIP | Brass | 2.54 mm | 0.1 in | Beryllium Copper | Gold | Solder | 20 | 3.18 mm | 0.125 in | 200 µin | 5.08 µm |