CONN RCPT 16POS 0.031 TIN SMD
| Part | Number of Rows | Contact Material | Operating Temperature [Max] | Operating Temperature [Min] | Connector Type | Contact Type | Insulation Height | Insulation Height | Fastening Type | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Termination | Number of Positions | Number of Positions Loaded | Insulation Material | Material Flammability Rating | Mounting Type | Insulation Color | Features | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Applications | Contact Shape | Contact Length - Mating | Contact Length - Mating | Contact Finish - Post | Shrouding | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics | 2 | Copper Alloy | 85 °C | -40 °C | Receptacle | Forked | 3.25 mm | 0.128 in | Push-Pull | 0.5 A | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Surface Mount | Black | Board Guide Solder Retention | 1.5 mm | 0.059 in | General Purpose | Square | |||||
JAE Electronics | 2 | Copper Alloy | 85 °C | -40 °C | Receptacle | Forked | 3.25 mm | 0.128 in | Push-Pull | 0.5 A | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Surface Mount | Black | Solder Retention | 1.5 mm | 0.059 in | General Purpose | Square | |||||
JAE Electronics | 2 | Copper Alloy | 85 °C | -40 °C | Header | Male Pin | 4.7 mm | 0.185 in | Push-Pull | 500 mA | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) Glass Filled | Surface Mount Right Angle | Black | Board Guide Solder Retention | 1.5 mm | 0.059 in | Square | 1.8 mm | 0.071 in | Tin | Shrouded - 4 Wall | |||
JAE Electronics | 2 | Copper Alloy | 85 °C | -40 °C | Receptacle | Forked | 3.25 mm | 0.128 in | Push-Pull | 0.5 A | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Surface Mount | Black | Solder Retention | 1.5 mm | 0.059 in | General Purpose | Square | |||||
JAE Electronics | 2 | Copper Alloy | 85 °C | -40 °C | Header | Male Pin | 4.7 mm | 0.185 in | Push-Pull | 500 mA | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) Glass Filled | Surface Mount Right Angle | Black | Board Guide Solder Retention | 1.5 mm | 0.059 in | Square | 1.8 mm | 0.071 in | Tin | Shrouded - 4 Wall | |||
JAE Electronics | 2 | Copper Alloy | 85 °C | -40 °C | Receptacle | Forked | 3.25 mm | 0.128 in | Push-Pull | 0.5 A | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Surface Mount | Black | Board Guide Solder Retention | 1.5 mm | 0.059 in | General Purpose | Square | Gold | ||||
JAE Electronics | 2 | Brass | 85 °C | -40 °C | Header | Male Pin | 3.66 mm | 0.144 in | Push-Pull | 500 mA | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) | Surface Mount | Black | Board Guide Solder Retention | 1.5 mm | 0.059 in | Square | 1.8 mm | 0.071 in | Tin | Shrouded - 4 Wall | |||
JAE Electronics | 2 | Brass | 85 °C | -40 °C | Header | Male Pin | 3.66 mm | 0.144 in | Push-Pull | 500 mA | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) | Surface Mount | Black | Board Guide Solder Retention | 1.5 mm | 0.059 in | Square | 1.8 mm | 0.071 in | Tin | Shrouded - 4 Wall | |||
JAE Electronics | 2 | Copper Alloy | 85 °C | -40 °C | Header | Male Pin | 3.66 mm | 0.144 in | Push-Pull | 0.5 A | 0.031 in | 0.8 mm | Solder | 16 | All | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Surface Mount | Black | Board Guide | 1.5 mm | 0.059 in | General Purpose | Square | 1.8 mm | 0.071 in | Shrouded - 4 Wall |