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CONN SOCKET PGA ZIF GOLD
| Part | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Mounting Type | Termination | Contact Finish - Post | Contact Material - Mating | Pitch - Post | Pitch - Post | Features | Operating Temperature [Max] | Operating Temperature [Min] | Material Flammability Rating | Contact Finish - Mating | Termination Post Length | Termination Post Length | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1 A | 200 µin | 5.08 µm | PGA ZIF (ZIP) | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Through Hole | Solder | Tin | Beryllium Copper | 2.54 mm | 0.1 in | Closed Frame | 125 °C | -65 ░C | UL94 V-0 | Gold | 3.18 mm | 0.125 in | Beryllium Copper |